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YG163 Electronic Microsphere Debonding Experimental Tester:

About our product：

The electronic microsphere debonding experiment tester is used to test the pull-out force of the symmetrical resin microspheres vertically embedded in the fiber, and estimate the bonding strength of the fiber-resin interface through the bonding length or bonding area.

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【Scope of application】

The electronic microsphere debonding experiment tester is used to test the pull-out force of the symmetrical resin microspheres vertically embedded in the fiber, and estimate the bonding strength of the fiber-resin interface through the bonding length or bonding area.

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Tel：0577-86387100
        0577-86387200

Email address: jigaotest@163.com

Address: No. 1, Fudebao Road, Gaoxiang Industrial Zone, Xinqiao Street, Ouhai District, Wenzhou, Zhejiang

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Wenzhou Jigao

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